Title – PCB layout Engineer
Location – Remote
The ideal candidate should have strong relevant and recent technical and hands-on background
and be able is hit the ground running as an individual contributor
- Contribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products.
- Ensure compliance with IPC standards, company design practices, and fabrication capabilities.
- Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.
- Work with PCB fabricators, and substrate vendors to close DFMs.
Minimum Requirements
- Bachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.
- Expert-level proficiency with Cadence Allegro PCB design tools
- Strong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.
- Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.
- Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.)
- Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs
- Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.
- Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules.